Electronic circuit board cleaning agent - List of Manufacturers, Suppliers, Companies and Products

Exploring the Current State of Solder Cleaning - The Evolution of Solder and Cleaning - [Technical Document Download]

Why was cleaning considered essential? An explanation of the cleaning needs for no-clean solder and other related topics.

This document introduces the evolution of solder and cleaning. It explains why cleaning of products is necessary after soldering and discusses the challenges of cleaning no-clean solder. Additionally, it covers the metal composition of solder and the effectiveness of MPC cleaning agents on no-clean solder. We encourage you to read it. 【Contents (partial)】 ■ The trajectory of "solder," a key player in the development of civilization ■ Why was cleaning deemed essential? ■ The metal composition of solder ■ Why does the demand for cleaning no-clean solder arise? ■ Why is cleaning "no-clean solder" difficult? *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Review of Cleaning Mechanisms - Limitations of Existing Cleaning Methods - [Technical Document]

Limitations of existing cleaning methods and challenges in difficult cleaning! An explanation of low standoff cleaning and more.

In this document, we propose our cleaning process as a solution to the increasingly challenging cleaning requirements, using "low stand-off" as an example. In recent times, with technological innovations occurring in various fields, electronics cleaning has progressed to a new stage and is becoming more "challenging." We provide explanations regarding the background and key points of cleaning demand, as well as the importance of cleaning methods, so please take a moment to read through it. 【Contents (partial)】 ■ Introduction – Changes in cleaning demand trends ■ The challenges of cleaning – High performance of products ■ Background and key points of cleaning demand for low stand-off ■ Ensuring wettability and cleaning performance for low stand-off cleaning ■ Benefits of cleaning using MPC *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Why is cleaning necessary for sintering bonding? [Cleaning issues in sintering bonding]

Explaining why cleaning is necessary for sintering bonding! Introducing cleaning know-how.

The joining technology of silver sintering (silver sinter) has been attracting attention in recent years. With the increase in electrical capacity and the utilization of new materials, there is a need for "new joining technologies" that can withstand higher temperatures, higher voltages, and larger currents. The silver sintering process can form a high-density bonding layer through pressing and sintering, resulting in high bonding strength. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

Company：ゼストロンジャパン
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Verification of cleaning properties of solder paste for fine bonding in joint research with Nippon Superior Co., Ltd.

A fundamental transformation is required for cleaning methods and cleaning agents! Introducing cleaning know-how.

Advanced electronic devices, such as 5G-compatible communication equipment and control units for electric vehicles, are becoming smaller and thinner. Consequently, the development of solder paste for fine bonding is becoming increasingly active. These electronic devices require long-term high reliability, and there is a growing trend for the need for flux cleaning. Due to high-density mounting and the diversification of components, there is an increase in electronic devices with low stand-off. *For more details, please refer to the related links. *The PDF document is a technical resource that explains the cleaning technology required for sintering bonding.

Company：ゼストロンジャパン
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Zero defects and half the cleaning time [Improvement case]

About the flux cleaning of high-performance control boards! Introducing cleaning know-how.

In the flux cleaning of high-performance control boards, we adopted an organic solvent-based cleaning agent combined with a jet flow method. While this method was able to clean the exposed surfaces of the boards, it could not completely clean the underside of components with a standoff of less than 20μm, resulting in defects where the required performance was not achieved. This page introduces the method that solved this issue. *For more details, please refer to the related links. *The PDF document is a technical material that explains cleaning technology for advanced electronic components.

Company：ゼストロンジャパン
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Compliance with regulations and safety measures for cleaning agents! A step-by-step explanation of purchasing, using, and storing.

Introducing regulations related to cleaning agents, taking into account efforts overseas!

In recent years, from the perspective of environmental conservation and human protection, countries have been strengthening regulations regarding the handling of chemical substances, and there is a global trend towards initiatives related to the SDGs (Sustainable Development Goals). In Japan, the Industrial Safety and Health Act will be revised in April 2024, strengthening the handling of chemical substances. To reduce health risks for workers and environmental burdens, some companies are moving to avoid procuring materials that have a significant environmental impact, and cleaning agents are no exception. Taking into account initiatives overseas, we will introduce regulations related to cleaning agents. *For detailed information, please refer to the related links. For further inquiries, feel free to contact us.*

Company：ゼストロンジャパン
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Ion Residues on Electronic Substrates and Their Analytical Methods [Free Download]

Examples of the analysis of the cleaning properties of surfactants are also included! We will also introduce ions and flux.

This document explains the analysis of ionic residues on electronic substrates that our company, as a cleaning agent manufacturer, has been working on. It includes explanations about ions and flux, as well as discussions on ion contamination measurement, ion chromatography, and scanning electron microscopy with energy dispersive X-ray spectroscopy. Additionally, it features case studies on the cleaning efficacy of surfactants. We encourage you to download it and read through it. 【Contents】 ■ Introduction ■ What are ionic residues? ■ Analysis of ionic residues remaining on electronic substrates ■ Case study - Cleaning efficacy of surfactants - ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Printed Circuit Board

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Three Key Points of Technological Evolution in Electronics Implementation and Cleaning

Trends in flux cleaning due to miniaturization! Introducing technical points in fine bonding products.

Electronics assembly refers to the technology of mounting electronic components onto a substrate. Specifically, it involves the process of joining components such as semiconductors, resistors, and capacitors to a printed circuit board to form an electrical circuit. The sizes of these components tend to become smaller in response to the demands for higher performance and space-saving in products, and accordingly, fine joining technologies are also evolving. This has a significant impact on the cleaning processes as well. We will explain the evolution of joining technologies and cleaning in fine joining. *For detailed content of the article, you can view it through the related links. For more information, please download the PDF or feel free to contact us.*

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Cleaning technology required for sintered joint devices [Technical Document]

Introduction to the specific sintering cleaning process! Discussion of the differences from flux cleaning, etc.

This document explains the cleaning techniques required for sintered joining devices. It discusses the background for the need for cleaning in sintered joining devices and the differences from flux cleaning, as well as introducing specific cleaning processes. It also includes information on the selection of cleaning agents and methods, as well as cleanliness analysis after cleaning. We encourage you to read it. 【Contents】 ■ Introduction ■ The formation of contamination and the effects of residues in sintered joining devices ■ Selection of cleaning agents and methods ■ Cleanliness analysis after cleaning ■ Cleaning case studies ■ Conclusion *For more details, please download the PDF or feel free to contact us.

Company：ゼストロンジャパン
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Zestron Japan Co., Ltd. Product Catalog

For cleaning flux on printed circuit boards! A variety of water-based and solvent-based cleaners are available.

This catalog introduces the product lineup of Zestron Japan Co., Ltd. It includes examples of products suitable for situations such as "printed circuit board cleaning" and "package and wafer cleaning," as well as applications and features. We also provide explanations of each product's technology and brand, along with the lineup. Please make use of this information when selecting products. [Contents (partial)] ■ Cleaning process introduction flow ■ Printed circuit board cleaning ■ Flux removal for power electronics ■ Package and wafer cleaning ■ Cleaning of metal masks, screens, and misprinted circuit boards *For more details, please refer to the PDF document or feel free to contact us.

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Examples of technical challenges related to 5G

Behind the scenes of 5G development by the responsible company! Introducing cleaning know-how.

"5G," which has gained even more attention due to the new coronavirus. In Japan, commercial services started in the spring of 2020, and it is said to have an impact not only on mobile phones but also in various fields such as automobiles, industrial equipment, and healthcare. Since it is a technology that has evolved further from 4G, it is easy to imagine that there were many challenges in its development. Curious about the background, I spoke with companies involved in the development of 5G. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

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Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

By selecting cleaning solder paste and flux, you can ensure more reliable cleanliness!

The theme of this discussion is ions, which are essential for electronic devices. However, unintended ions can remain on the device surface, between electrodes, or in low stand-off areas, resulting in "ion residue." Moreover, since these residues can be supplied from various contamination pathways that include not only raw material factors but also environmental factors, achieving a residual amount of zero is technically very challenging. In this instance, we have collaborated with solder manufacturers to assess the ion residue levels for each implemented component. *For more detailed information, please refer to the related links. *The PDF document is a technical resource that explains the issues and analysis methods related to ion residue.

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Effects of morphological changes in flux residues after soldering on cleanability.

[Joint Research] Joint research on the effects of morphological changes on washability! Detailed explanations and images are presented.

The no-clean solder paste, which continues to evolve, generates significant heat in fields such as 5G devices and high-power devices for electric vehicles (EVs). As environmental burdens increase, it is necessary to pay attention to long-term changes even in stabilized flux residues. Recent market trends have led to the miniaturization of high-performance electronic devices, resulting in reduced distances between components. This, along with the demand for high-speed calculations and increased capacity, has resulted in high currents and voltages. Consequently, even slight flux residues that were previously not problematic can pose various risks, making cleaning necessary in high-reliability devices, even for no-clean flux residues. Together with Mr. Hiroki, who is developing high-performance solder paste, we conducted joint research on the morphological changes of flux residues after soldering and their impact on cleanability. *For more details, please refer to the related links. *The PDF document is a technical material explaining the evolution and challenges of power devices.

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Verification of the cleaning properties of Sn-Bi low melting point solder paste - Joint Research

Published solutions to challenges in the formation of metal salts (Bi salts)! We conducted joint verification of cleaning performance.

The Sn-Bi solder paste has various advantages, but in high-reliability fields, there are situations where cleaning is required, and one of the cleaning challenges is the formation of metal salts (Bi salts) after sintering. Bi salts can potentially cause migration issues, are difficult to dissolve in organic solvents, and make cleaning challenging. To address the issue of Bi salt formation, we conducted a joint verification of the cleaning properties of the low-melting-point Sn-Bi solder paste developed by Japan Superior Inc. *For more details, please refer to the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.

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Electronic circuit board cleaning agent - List of Manufacturers, Suppliers, Companies and Products

Electronic circuit board cleaning agent Product List